HYDRONAUT
With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water cooling system, for example.
-
Suitable for overclocking
-
Excellent thermal conductivity
-
No curing
-
Silicone free
-
Not electrically conductive
-
Applicable to aluminium coolers
(warning label is exclusively for Conductonaut!)
|
operation area |
Rating |
|
Thermal conductivity |
**** |
|
Sub-zero overclocking |
**** |
|
Overclocking |
***** |
|
Water cooling |
***** |
|
Air cooling |
***** |
|
Silicone sensitive applications |
***** |
The Hydronaut Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling sector.
The Hydronaut thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the thermal paste can be applied very easily.
Hydronaut achieves optimal values ??for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easily applied heat transfer medium for demanding users.
|
Thermal resistance |
0.0076 K / W
|
|
Electrical conductivity * |
0 pS / m
|
|
viscosity |
140-190 pas |
|
Spec. Weight |
2.6g / cm3 |
|
temperature |
-200 ° C / +350 ° C |
|
content |
1g |
* according to DIN 51412-1